Chips EVA Hot Glue Book Binding, colagem EVA-KG-7G do emperramento de livro branco
High Performance & Low Cost, Viscosity 6500±1000mpa·s (160℃) White Chips Bulk WANLI® KG-7G EVA Hot Melt for Normal Paper Book Back Binding with Paper Weight of 70~80G/m² Wanli® EVA hot melt adhesive KG-7G for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-7G is ...
colagem quente do derretimento dos esparadrapos do emperramento de livro 70-80gsm para as espinhas EVA-KG-7D do livro
Hot Sale High Quality White Flaky Solid EVA Hot Melt Adhesive WANLI® KG-7D with Viscosity 6500±1000mpa·s (@160℃) for Book Binding in High Temperature Areas and Summer Wanli® EVA hot melt adhesive KG-7D for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-7D is ...
Colagem translúcida traseira do livro para EVA Hot Melt contínua obrigatória de papel EVA-8221
China Factory Promotion Low Cost Bulk EVA Hotmelt WANLI® 8221 with Viscosity 6000±1000mpa·s (160℃) for Book Back Binding in Graphic Shop with Paper Weight ≤157G/m² Wanli® EVA hot melt adhesive 8221 for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. 8221 is ...
Esparadrapos de uma encadernação de 150 graus que curam rapidamente as pelotas obrigatórias perfeitas amareladas EVA-C-21 da colagem
Hot Selling Online Shop Bulk Yellowish Pellet EVA Hot Melt Adhesive WANLI® C-21 with High Viscosity 4800±800mpa·s (130℃) for Book Cover Bonding Application Wanli® EVA hot melt adhesive C-21 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-21 is specifically ...
Branco à colagem amarelada para a encadernação, colagem obrigatória de PUR do derretimento quente para PUR-7215 de papel
12-02-Book Binding Adhesives-Book Back Binding Adhesives-PUR-7215 Wanli® PUR hot melt adhesive PUR-7215 for book back bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7215 can be used for paper, PET, PVC, and thin metal sheets. PUR-7215 is featured stable ...
